Curable silicone composition and cured product of same, multilayer body and method for producing same, and optical device or optical display

ABSTRACT

Provided is a curable silicone composition, a cured product thereof, a laminate body, a manufacturing method thereof, and an optical device or optical display exhibiting excellent performance for use as a member where transparency is required such as for an optical display, a touch panel, or the like. A curable silicone composition, comprises: (A) an organopolysiloxane having in a molecule at least 2 alkenyl groups with 2 to 12 carbon atoms; (B) an organohydrogenpolysiloxane having at least 2 silicon-bonded hydrogen atoms per molecule; and (C) a hydrosilylation reaction catalyst. Component (B) is present in an amount such that the silicon-bonded hydrogen atoms in component (B) are 0.5 to 2 mol per mol of aliphatic unsaturated carbon-carbon bonds in component (A), and 2 to 17.5 mol % of the silicon-bonded organic groups in the curable silicone composition are aryl groups.

TECHNICAL FIELD

The present invention is related to a curable silicone composition,cured product thereof, laminate body, manufacturing method thereof, andoptical device or optical display.

BACKGROUND ART

Curable silicone compositions with high transparency and high elongationof a cured product are used as adhesives or pressure sensitive adhesivesfor improving the visibility of an optical display. An optical displaymust use a thermally unstable material such as liquid crystals, organicelectroluminescence, and other display parts, touch panels, coverlenses, and other display forming members. Therefore, the used curablesilicone composition is preferably cured at a relatively lowtemperature, specifically 40° C. or lower, and ultraviolet curablesilicone compositions having been primarily applied thus far.

However, there is a demand for a low temperature curable siliconecomposition which does not require ultraviolet radiation becausedecorative portions for decoration are often provided in the displayperiphery and ultraviolet light is not transmitted. For example, PatentDocument 1 proposes a curable silicone composition containing: anorganopolysiloxane containing an alkenyl group and an aryl group; anorganopolysiloxane containing a silicon-bonded hydrogen atom; a compoundhaving a polyalkylene oxide chain; and a platinum based catalyst.

However, with conventional curable silicone compositions, the durabilityof an obtained cured product at low temperatures may be insufficient,and thus use may not be possible in aircraft or in cold regions.Furthermore, when a specific substitution group is introduced to improvecold resistance, the cured product becomes discolored or turbid, andthus can not be used in optical displays or touch panels.

For example, as a technology for improving the cold resistance of acomposition, Patent Document 2 proposes the use of an organopolysiloxanecontaining 1 mol % or more a phenyl group for the purpose of improvingthe cold resistance of a silicone adhesive sheet. However, the documentis intended for forming a sheet and does not describe or suggest a curedsilicone composition for use in optical displays or the like.Furthermore, the curable silicone composition used for optical displaysand the like is required to have high transparency in addition toadhesion. However, when a phenyl group is simply introduced into thecurable silicone composition, compatibility is insufficient betweencomponents, which causes a decrease in transparency and turbidity. Thus,the cured product has a problem where discoloration or turbidity occurs.

RELATED ART DOCUMENTS Patent Documents Patent Document 1: JapaneseUnexamined Patent Application 2012-111850 Patent Document 2: JapaneseUnexamined Patent Application H10-012546 SUMMARY OF THE INVENTIONProblem to be Solved by the Invention

Therefore, as a curable silicone composition used in adhesives orpressure sensitive adhesives for optical displays, touch panels, and thelike, there has been a demand for a composition that has excellentdurability at low temperatures and a cured product with excellenttransparency can be obtained.

In light of the problems of the conventional technology described above,an object of the present invention is to provide a curable siliconecomposition, a cured product thereof, a laminate body, a manufacturingmethod thereof, and an optical device or optical display exhibitingexcellent performance for use as a member where transparency is requiredsuch as for an optical display, a touch panel, or the like.Specifically, an object of the present invention is to provide a curablesilicone composition having excellent durability at low temperatures anda cured product having excellent transparency can be obtained.

Means for Solving the Problem

As a result of conducting diligent research on the problems describedabove, the present inventors arrived at the present invention. In otherwords, an object of the present invention is achieved by:

A curable silicone composition, containing:(A) an organopolysiloxane having in a molecule at least 2 alkenylgroups, each with 2 to 12 carbon atoms;(B) an organohydrogenpolysiloxane having at least 2 silicon-bondedhydrogen atoms per molecule; and(C) a hydrosilylation reaction catalyst; wherethe amount of component (B) is an amount such that the silicon-bondedhydrogen atoms in component (B) are 0.5 to 2 mol per mol of aliphaticunsaturated carbon-carbon bonds in component (A), and2 to 17.5 mol % of the silicon-bonded organic groups in the curablesilicone composition are aryl groups.

In particular, 2 to 20 mol % of the silicon-bonded organic groups incomponent (A) are preferably aryl groups.

Component (A) preferably contains the following components (a1) and(a2):

(a1) a straight chain or partially branched organopolysiloxane having inone molecule at least 2 alkenyl groups, each with 2 to 12 carbon atoms,where 3 to 25 mol % of silicon-bonded organic groups are aryl groups;and(a2) an organopolysiloxane having an alkenyl group, as expressed byaverage unit formula: (R¹ ₃SiO_(1/2))_(a)(R¹₂SiO_(2/2))_(b)(R¹SiO_(3/2))_(c)(SiO_(4/2))_(d) (where R¹ independentlyrepresents a monovalent hydrocarbon group with 1 to 12 carbon atoms, atleast 1 mol % of R¹ is an alkenyl group with 2 to 12 carbon atoms, anda, b, c and d satisfy all of the following conditions: (a+b+c+d=1,0≤a≤0.8, 0≤b≤0.4, 0≤c≤0.8, 0≤d≤0.6, 0.2≤c+d≤0.8); and component (B)preferably contains the following components (b1) and (b2):(b1) a straight chain organohydrogenpolysiloxane having a silicon-bondedhydrogen atom on an end of a molecular chain; and(b2) an organohydrogenpolysiloxane having 3 or more silicon-bondedhydrogen atoms in one molecule.

In particular, the amount of component (a2) is more preferably within arange of 0.5 to 5.0 mass % relative to the sum of components forming anon-volatile solid fraction by a curing reaction of the curable siliconecomposition, and

the amount of component (b2) is more preferably within a range of 0 to2.0 mass % relative to the sum of components forming a non-volatilesolid fraction by a curing reaction of the curable silicone composition.

The curable silicone composition of the present invention preferablyfurther contains (D) an organic compound having two or more alkoxysilylgroups in one molecule.

In the curable silicone composition of the present invention,

i) the amount of a polyether compound is preferably 0.1 mass % or lessrelative to the total amount of the curable silicone composition, andii) the amount of a compound having an epoxy group and alkoxysilyl groupis preferably 0.1 mass % or less relative to the total amount of thecurable silicone composition.(D) The content of the component (D) is preferably in a range of 0.001to 5 mass % relative to the total amount of the curable siliconecomposition.

Component (C) is preferably selected from a group consisting of:

(c1) a hydrosilylation reaction catalyst that exhibits active activitywithout irradiating with a high energy beam;(c2) a hydrosilylation reaction catalyst that exhibits activity byirradiating with a high energy beam; and(c3) a hydrosilylation reaction catalyst that is a combination ofcomponent (c1) and component (c2).

Herein, high energy beams include ultraviolet rays, gamma rays, X-rays,alpha rays, electron beams, and the like, and ultraviolet rays, X-rays,and electron beams irradiated from a commercially available electronbeam irradiating device are preferable. Industrially, ultraviolet rayshaving a wavelength within a range of 280 to 380 nm are easily used.

Component (D) preferably contains (d1), a compound having twoalkoxysilyl groups at an end of a molecular chain.

The viscosity of the curable curing silicone composition at 25° C. ispreferably 100,000 mPa or less.

The curable silicone composition of the present invention is preferablyan optical adhesive or an optical pressure sensitive adhesive.

The present invention also relates to a cured product of the curablesilicone composition of the present invention.

The cured product of the curable silicone composition of the presentinvention preferably has a degree of needle penetration at 25° C. withina range of 5 to 70.

Furthermore, the present invention also relates to a laminate bodycontaining:

an adhesive layer containing the cured product of the present invention,disposed between a first transparent or non-transparent optical memberand a second transparent or non-transparent optical member.

Furthermore, the present invention also relates to an optical device,containing:

a substrate;an optical element disposed on the substrate;the cured product of the present invention that seals at least a portionof the optical element.

Furthermore, the present invention also relates to an optical displaycontaining the laminate body of the present invention.

The present invention also relates to a method of manufacturing alaminate body, including: an arranging step of arranging the curablesilicone composition of the present invention, containing at least thehydrosilylation catalyst that exhibits activity without irradiating witha high energy beam, on one or two surfaces of at least one member of thetwo optical members, and then adhering the two optical members togethervia the curable silicone composition; and a curing step of promoting ahydrosilylation reaction of the composition by allowing to stand orheating to cure the composition.

Note that an optical member configuring the laminate body of the presentinvention is generally provided with a plate shaped portion having aplanar expanse, and the plate shaped portion or the member itself may becurved and may have three-dimensional recesses and protrusions derivedfrom an application of the member. Furthermore, the cured productdisposed on two surfaces of the optical member and is not used foradhering with another optical member can be used as an adhesive surfacefor bonding to a release layer or another member.

Furthermore, the present invention also relates to a method ofmanufacturing a laminate body, including: an arranging step of arrangingthe curable silicone composition of the present invention, containing atleast the hydrosilylation catalyst that exhibits activity by irradiatingwith a high energy beam, on one or two surfaces of at least one memberof the two optical members, and then adhering the two optical memberstogether via the curable silicone composition; and a curing step ofirradiating with the high energy beam, and then allowing to stand orheating to promote a hydrosilylation reaction of the composition to curethe composition.

Furthermore, the present invention also relates to a method ofmanufacturing a laminate body, including: an arranging step of arrangingthe curable silicone composition of the present invention, containing atleast the hydrosilylation catalyst that exhibits activity by irradiatingwith a high energy beam, on one or two surfaces of at least one memberof the two optical members, performing high energy beam irradiation toform a non-fluid, semi-cured state, and then adhering the two opticalmembers together via the curable silicone composition; and a main curingstep of promoting a hydrosilylation reaction of the composition byallowing to stand or heating to main cure the composition.

Furthermore, the present invention also relates to a method ofmanufacturing a laminate body, including: an arranging step of arrangingthe curable silicone composition of the present invention, containingboth the hydrosilylation catalyst that exhibits activity withoutirradiating with a high energy beam and the hydrosilylation catalystthat exhibits activity by irradiating with a high energy beam, on one ortwo surfaces of at least one member of the two optical members, causinga hydrosilylation reaction of the composition by allowing to stand orheating to form a non-fluid, semi-cured state in a low temperatureregion (15 to 80° C.) including room temperature (25° C.), and thenadhering the two optical members together via the curable siliconecomposition; and a main curing step of performing high energy beamirradiation via a transparent substrate and then allowing to stand orheating to promote a hydrosilylation reaction of the composition in asemi-cured state to main cure the composition.

Furthermore, the present invention also relates to a method ofmanufacturing a laminate body, including: an arranging step of arrangingthe curable silicone composition of the present invention, containing atleast the hydrosilylation catalyst that exhibits activity withoutirradiating with a high energy beam, on one or two surfaces of at leastone member of the two optical members, causing a hydrosilylationreaction of the composition by allowing to stand or heating to form anon-fluid, semi-cured state in a low temperature region (15 to 80° C.)including room temperature (25° C.), and then adhering the two opticalmembers together via the curable silicone composition; and a main curingstep of promoting a hydrosilylation reaction of the composition in asemi-cured state by allowing to stand or heating to main cure thecomposition.

Furthermore, the present invention also relates to a method ofmanufacturing a laminate body, where the laminate body is an opticaldevice.

Furthermore, the present invention also relates to a method ofmanufacturing a laminate body, where the laminate is an optical display.

Effects of the Invention

The curable silicone composition of the present invention has excellentcold resistance after curing, can be used in a low temperatureenvironment, does not cause problems such as coloring, and can obtain ahighly transparent cured product. Therefore, the composition is usefulwhen used as an adhesive or pressure sensitive adhesive for an opticaldisplay or a touch panel.

Furthermore, the cured product and the laminate body of the presentinvention has excellent physical properties as an adhesive or a pressuresensitive adhesive, are optically transparent, and have excellentadhesive strength and durability. Therefore, reliability is excellentwithout reduced performance under any conditions.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross sectional view illustrating a laminate body of anembodiment of the present invention.

FIG. 2 is a flowchart showing a method of manufacturing the laminatebody of the embodiment of the present invention.

FIG. 3 is a flowchart showing a method of manufacturing a laminate bodyof another embodiment of the present invention.

FIG. 4 is a plan view illustrating a Micro LED according to anembodiment of the present invention.

FIG. 5 is a cross sectional view illustrating the Micro LED according tothe embodiment of the present invention.

FIG. 6 is a cross sectional view illustrating a Micro LED according toanother embodiment of the present invention.

FIG. 7 is a cross sectional view of a Micro LED in which a set of red(R), green (G), and blue (B) light emitting elements are arranged on alead frame according to an embodiment of the present invention.

FIG. 8 is a cross sectional view illustrating an optical display of anembodiment of the present invention.

FIG. 9 is a cross sectional view illustrating an optical display ofanother embodiment of the present invention.

FIG. 10 is a cross sectional view illustrating an optical display ofanother embodiment of the present invention.

FIG. 11 is an exploded perspective view illustrating an optical displayof another embodiment of the present invention.

FIG. 12 is a partial cross sectional view illustrating an opticaldisplay of another embodiment of the present invention.

FIG. 13 is a partial cross sectional view illustrating an opticaldisplay of another embodiment of the present invention.

FIG. 14 is a partial cross sectional view illustrating an opticaldisplay of another embodiment of the present invention.

FIG. 15 is a partial cross sectional view illustrating an opticaldisplay of another embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENT [Curable Silicone Composition]

The curable silicone composition of the present invention (hereinafter,also referred to as “the present composition”) will be described belowin detail.

Component (A) is an organopolysiloxane having in each molecule at least2 alkenyl groups with 2 to 12 carbon atoms. Preferable examples of thealkenyl group in component (A) include vinyl groups, allyl groups,butenyl groups, pentenyl groups, hexenyl groups, heptenyl groups,octenyl groups, nonenyl groups, decenyl groups, undecenyl groups, anddodecenyl groups. Vinyl groups, allyl groups, hexenyl groups, andoctenyl groups are preferable from the perspective of economicefficiency and reactivity.

Furthermore, examples of other groups that are bonded to a silicon atomin component (A) include: methyl groups, ethyl groups, propyl groups,butyl groups, pentyl groups, hexyl groups, heptyl groups, octyl groups,nonyl groups, decyl groups, undecyl groups, dodecyl groups, and otheralkyl groups having 1 to 12 carbon atoms; benzyl groups, phenethylgroups, and other aralkyl groups having 7 to 12 carbon atoms;3-chloropropyl groups, 3,3,3-trifluoropropyl groups, and otherhalogen-substituted alkyl groups having 1 to 12 carbon atoms; phenylgroups, tolyl groups, xylyl groups, and other aryl groups having 6 to 20carbon atoms; and groups in which some or all hydrogen atoms of theaforementioned groups are substituted with a fluorine atom, chlorineatom, bromine atom, or other halogen atom. Methyl groups are preferablefrom the perspective of economic efficiency and heat resistance.Furthermore, the silicon atom in component (A) may be bonded to a smallamount of hydroxyl groups or alkoxy groups such as methoxy groups,ethoxy groups, n-propoxy groups, i-propoxy groups, n-butoxy groups,sec-butoxy groups, tert-butoxy groups, and the like so long as an objectof the present invention is not impaired.

While the molecular structure of component (A) is not particularlylimited, examples thereof include straight chain structures, partiallybranched straight chain structures, branched structures, cyclicstructures, and three-dimensional mesh structures. Component (A) may bea single organopolysiloxane having these molecular structures or amixture of two or more organopolysiloxanes having these molecularstructures.

Component (A) preferably contains the following component (a1) andcomponent (a2):

(a1) a straight chain or partially branched organopolysiloxane having ina molecule at least 2 alkenyl groups, each with 2 to 12 carbon atoms andwhere 3 to 25 mol % of the silicon-bonded organic groups are arylgroups; and(a2) an organopolysiloxane having an alkenyl group, as expressed byaverage unit formula: (R¹ ₃SiO_(1/2))_(a)(R¹₂SiO_(2/2))_(b)(R¹SiO_(3/2))_(c)(SiO_(4/2))_(d) (where R¹ independentlyrepresents a monovalent hydrocarbon group with 1 to 12 carbon atoms, atleast 1 mol % of R¹ is an alkenyl group with 2 to 12 carbon atoms, anda, b, c and d satisfy all of the following conditions: (a+b+c+d=1,0≤a≤0.8, 0≤b≤0.4, 0≤c≤0.8, 0≤d≤0.6, 0.2≤c+d≤0.8).

Examples of component (a1) includedimethylpolysiloxane-methylphenylsiloxane copolymers blocked at bothends of a molecular chain with dimethyvinylsiloxy groups,dimethylpolysiloxane-diphenylsiloxane copolymers blocked at both ends ofa molecular chain with dimethyvinylsiloxy groups,dimethylpolysiloxane-diphenylsiloxane copolymers blocked at both ends ofa molecular chain with dimethyvinylsiloxy groups, anddimethylpolysiloxane-methylnaphthyl siloxane copolymers blocked at bothends of a molecular chain with dimethyvinylsiloxy groups. Examplesthereof include dimethylpolysiloxane-methylphenylsiloxane copolymersblocked at both ends of a molecular chain with methylphenylvinylsiloxygroups and mixtures of two or more of these organopolysiloxanes.

In the formula of component (a2), R¹ independently represents amonovalent hydrocarbon group having 1 to 12 carbon atoms, and examplesinclude alkyl groups, alkenyl groups, aryl groups, aralkyl groups, andgroups in which some or all of the hydrogen atoms of the aforementionedgroups are substituted with a fluorine atom, a chlorine atom, a bromineatom, or other halogen atom. However, at least 1 mol % of R¹ is analkenyl group having 2 to 12 carbon atoms.

Examples of component (a2) include tetrakis(dimethylvinylsiloxy)silane,hexa(dimethylvinylsiloxy)disiloxane, and organopolysiloxane resins asexpressed by the following average unit formulae:

(ViMe₂SiO_(1/2))_(0.1)(Me₃SiO_(1/2))_(0.4)(SiO_(4/2))_(0.5)

(ViMe₂SiO_(1/2))_(0.1)(Me₃SiO_(1/2))_(0.5)(SiO_(4/2))_(0.4)

(ViMe₂SiO_(1/2))_(0.05)(Me₃SiO_(1/2))_(0.55)(SiO_(4/2))_(0.4)

(ViMe₂SiO_(1/2))_(0.1)(Me₃SiO_(1/2))_(0.4)(PhSiO_(3/2))_(0.1)(SiO_(4/2))_(0.4)

(ViMe₂SiO_(1/2))_(0.046)(Me₃SiO_(1/2))_(0.394)(SiO_(4/2))_(0.56)

(ViMe₂SiO_(1/2))_(0.25)(PhSiO_(3/2))_(0.75)

Note that in the aforementioned formulae, Me represents a methyl group,Ph represents a phenyl group, and Vi represents a vinyl group.

The amount of component (a2) is within a range of 0.5 to 10.0 mass %,and preferably within a range of 1.0 to 5.0 mass % relative to the solidfraction of the curable silicone composition. Herein, solid fractionrefers to the sum of components forming a non-volatile solid fraction bya curing reaction, and particularly includes components (A) to (D) andnon-volatile optional components configuring the present composition.

In the curable silicone composition of the present invention, 2 to 17.5mol %, and preferably 3.5 to 15 mole % of the silicon-bonded organicgroups in component (A) are aryl groups. When the ratio of the arylgroups is within the aforementioned range, the curable siliconecomposition can have excellent cold resistance.

Examples of the aryl groups in component (A) include phenyl groups,tolyl groups, naphthyl groups, and xylyl groups, but from theperspective of economic efficiency, phenyl groups are preferred.

Furthermore, while the viscosity of component (A) at 25° C. is notlimited, the viscosity is preferably within a range of 50 to 100,000,within a range of 100 to 100,000 mPa·s, within a range of 100 to 50,000mPa·s, or within a range of 100 to 10,000 mPa·s. This is because, if theviscosity of component (A) is above the lower limit of theaforementioned range, the mechanical properties of the cured productobtained will be enhanced; in contrast, if the viscosity is below theupper limit of the aforementioned range, the handleability of thecomposition obtained will be enhanced.

Component (B) is an organopolysiloxane having at least twosilicon-bonded hydrogen atoms per molecule. Examples of groups that arebonded to a silicon atom other than silicon-bonded hydrogen atoms incomponent (B) include: alkyl groups with 1 to 12 carbon atoms such asmethyl groups, ethyl groups, propyl groups, butyl groups, pentyl groups,hexyl groups, heptyl groups, octyl groups, nonyl groups, decyl groups,undecyl groups, dodecyl groups, and the like; aryl groups with 6 to 20carbon atoms such as phenyl groups, tolyl groups, xylyl groups, and thelike; aralkyl groups with 7 to 20 carbon atoms such as benzyl groups,phenethyl groups, and the like; and halogen substituted alkyl groupswith 1 to 12 carbon atoms such as 3-chloropropyl groups,3,3,3-trifluoropropyl groups, and the like. Methyl groups and phenylgroups are preferable from the perspective of economic efficiency andheat resistance. Furthermore, the silicon atom in component (B) may bebonded to a small amount of hydroxyl groups or alkoxy groups such asmethoxy groups, ethoxy groups, n-propoxy groups, i-propoxy groups,n-butoxy groups, sec-butoxy groups, tert-butoxy groups, and the like solong as an object of the present invention is not impaired.

While the molecular structure of component (B) is not particularlylimited, examples thereof include straight chain structures, partiallybranched straight chain structures, branched structures, cyclicstructures, and three-dimensional mesh structures. Component (B) may bea single organopolysiloxane having these molecular structures or amixture of two or more organopolysiloxanes having these molecularstructures.

Preferably, the component (b) contains the following components (b1) and(b2):

(b1) a straight chain organohydrogenpolysiloxane having a silicon-bondedhydrogen atom on an end of a molecular chain; and(b2) an organohydrogenpolysiloxane having 3 or more silicon-bondedhydrogen atoms in one molecule.

Component (b1) is a straight chain organohydrogenpolysiloxane having asilicon-bonded hydrogen atom at an end of a molecular chain, which is acomponent that functions as a chain length extender in a hydrosilylationreaction with component (A) and improves the flexibility of the curedreaction product. Component (b1) preferably contains an aryl group orhas a low molecular weight in order to achieved favorable compatibilitywith component (A) containing the aryl group.

Examples of such component (b1) include 1,1,3,3-tetramethyldisiloxane,1,1,3,3,5,5-hexamethyltrisiloxane, dimethylpolysiloxanes blocked at bothends of a molecular chain with dimethylhydrogensiloxy groups,dimethylsiloxane-methylphenylsiloxane copolymers blocked at both ends ofa molecular chain with dimethylhydrogensiloxy groups,dimethylpolysiloxanes blocked at both ends of a molecular chain withdimethylhydrogensiloxy groups, didimethylsiloxane-diphenylsiloxanecopolymers blocked at both ends of a molecular chain withdimethylhydrogensiloxy groups, and mixture of two or more types of theseorganopolysiloxanes.

Component (b2) is an organohydrogenpolysiloxane having three or moresilicon-bonded hydrogen atoms in one molecule, which functions as acrosslinking agent in a hydrosilylation reaction with component (A) andadjusts the hardness of the cured product based on the added amountthereof. Component (b2) preferably contains an aryl group or has a lowmolecular weight in order to achieved favorable compatibility withcomponent (A) containing the aryl group.

Examples of such component (b2) include methyltris(dimethylsiloxy)silane, tetrakis(dimethylsiloxysilane),methylhydrogenpolysiloxane blocked at both ends of a molecular chainwith trimethylsiloxy groups, methylhydrogensiloxane-dimethylsiloxanecopolymers blocked at both ends of a molecular chain withtrimethylsiloxy groups, methylhydrogensiloxane-methylphenylsiloxanecopolymers blocked at both ends of a molecular chain withtrimethylsiloxy groups, and organopolysiloxane resins as expressed bythe following average unit formulae:

(HMe₂S_(1/2))_(0.6)(SiO_(4/2))_(0.4)

(HMe₂SiO_(1/2))_(0.3)(Me₃SiO_(1/2))_(0.3)(SiO_(4/2))_(0.4)

(HMe₂SiO_(1/2))_(0.5)(Me₃SiO_(1/2))_(0.05)(SiO_(4/2))_(0.4)

HMe₂SiO_(1/2))_(0.5)(PhSiO_(3/2))_(0.1)(SiO_(4/2))_(0.4)

(HMe₂SiO_(1/2))_(0.6)(PhSiO_(3/2))_(0.4)

(HMe₂SiO_(1/2))_(0.75)(PhSiO_(3/2))_(0.25)

and mixtures of two or more types of these organopolysiloxanes. Notethat in the aforementioned formulae, Me represents a methyl group and Phrepresents a phenyl group.

The component (b2) is an optional component, and the amount thereof iswithin a range of 0 to 2.0 mass %, may be within a range of 0.001 to 2.0mass %, and preferably 0.01 to 1.0 mass % relative to the solid fractionof the curable silicone composition. Herein, solid fraction refers tothe sum of components forming a non-volatile solid fraction by a curingreaction, and particularly includes components (A) to (D) andnon-volatile optional components configuring the present composition.

Although the viscosity of component (B) at 25° C. is not limited, theviscosity is preferably 10,000 mPa·s or less, within a range of 1 to1,000 mPa·s, or within a range of 1 to 500 mPa·s. This is because if theviscosity of component (B) is above the lower limit of theaforementioned range, the mechanical properties of an obtained curedproduct are enhanced. However, on the other hand, if the viscosity isbelow the upper limit of the aforementioned range, the transparency andhandleability of an obtained composition are enhanced.

The amount of the component (B) is an amount within a range of 0.5 to 2mols of silicon-bonded hydrogen atoms in the present component,preferably an amount of at least 0.6 mols, at least 0.7 mols, or atleast 0.8 mols, an amount of at most 1.7 mols, at most 1.5 mols, or atmost 1.3 mols, and an amount that is within an arbitrary range of theseupper and lower limits, relative to 1 mol of aliphatic unsaturatedcarbon-carbon bonds in component (A). This is because if the amount ofcomponent (B) is above the lower limit of the aforementioned range, anobtained composition will be sufficiently cured. However, on the otherhand, if the amount is below the upper limit of the aforementionedrange, the mechanical properties of an obtained cured product will beenhanced.

Component (C) is a hydrosilylation reaction catalyst for promoting thecuring of the present composition. Examples thereof include platinumbased catalysts, rhodium based catalysts, palladium based catalysts,nickel based catalysts, iridium based catalysts, ruthenium basedcatalyst, and iron based catalysts, and platinum based catalysts arepreferable.

The amount of component (C) is an amount that promotes the curing of thepresent composition and is specifically an amount in which the platinumatoms in the catalyst are within a range of from 0.1 to 1000 μm in massunits with respect to the present composition. This is because when theamount of component (C) is greater than or equal to the lower limit ofthe range described above, the curing of the resulting compositionprogresses, while when the amount is less than or equal to the upperlimit of the range described above, the resulting cured product becomesless susceptible to discoloration.

Examples of such component (C) that can be preferably used includecomponents selected from a group consisting of:

(c1) a hydrosilylation reaction catalyst that exhibits active activitywithout irradiating high energy beams;(c2) a hydrosilylation reaction catalyst that exhibits activity byirradiating high energy beams; and(c3) a hydrosilylation reaction catalyst, which is a combination ofcomponents (c1) and (c2).

Component (c1) is a hydrosilylation reaction catalyst that exhibitsactive activity without irradiating high energy beams. Component (c1) ispreferably a platinum based catalyst. Examples of the platinum basedcatalyst include platinum based compounds, such as platinum finepowders, platinum black, platinum-supported silica fine powders,platinum-supported activated carbon, chloroplatinic acids, alcoholsolutions of chloroplatinic acids, olefin complexes of platinum,alkenylsiloxane complexes of platinum, and the like. Alkenylsiloxanecomplexes of platinum are particularly preferable. Exemplaryalkenylsiloxanes include: 1,3-divinyl-1,1,3,3-tetramethyldisiloxane;1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane; alkenylsiloxanes obtained by substituting a portion of methyl groups of thealkenylsiloxanes with an ethyl group, a phenyl group, or the like; andalkenylsiloxanes obtained by substituting a portion of vinyl groups ofthese alkenylsiloxanes with an allyl group, a hexenyl group, or thelike. The platinum-alkenyl siloxane complex has favorable stability, andtherefore 1,3-divinyl-1,1,3,3-tetramethyldisiloxane is particularlypreferable. Furthermore, the stability of the platinum-alkenylsiloxanecomplex can be improved. Therefore,1,3-divinyl-1,1,3,3-tetramethyldisiloxane,1,3-diallyl-1,1,3,3-tetramethyldisiloxane,1,3-divinyl-1,3-dimethyl-1,3-diphenyldisiloxane,1,3-divinyl-1,1,3,3-tetraphenyldisiloxane, and1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane, or otheralkenylsiloxane or dimethylsiloxane oligomers or other organosiloxaneoligomers are preferably added to the complex, and an alkenylsiloxane isparticularly preferably added to the complex.

The catalyst of component (c1) is a catalyst that is active withoutirradiating with a high energy beam, and a catalyst that is active evenat a relatively low temperature is more preferable. Specifically,activity is exhibited in the composition in a temperature range of 0 to200° C., preferably a temperature range of 0 to 150° C., more preferablya temperature range of 0 to 150° C., even more preferably a temperaturerange of 20 to 150° C. to promote a hydrosilylation reaction. The amountof component (c1) varies depending on the type of catalyst and the typeof composition, but is usually an amount in which the metal atoms in thecatalyst are within a range of 0.01 to 50 ppm based on mass unitsrelative to the composition, and is preferably within a range of 0.1 to30 ppm. If the amount of the component is too low, the curing speed willbe too slow, and if the amount added is too high, the usable time willbe too short, which causes practical inconvenience and is alsouneconomical. Note that the hydrosilylation reaction sufficientlyprogresses even if the composition is left at room temperature without ahydrosilylation reaction retardant described later. Therefore, thepresent composition may be left at room temperature (25° C.) or may beheated higher than room temperature within the aforementionedtemperature range, in order to form a semi-cured state or a fully maincured state for the composition of the present invention. Morespecifically, the curable silicone composition of the present inventionmay form a semi-cured state or a fully main cured state at a relativelylow temperature range of 15 to 80° C. Note that in the presentinvention, the “semi-cured state” indicates a state where, as a resultof the curing reaction progressing, the composition loses fluidity andforms a cured reactant in a low temperature region (15 to 80° C.)including room temperature (25° C.), but the cured reactant stillmaintains curing reactivity, and the curing reaction further progressesby setting a curing condition such as continued irradiation of a highenergy beam, heating, or the like. The cured reactant in the semi-curedstate is referred to as a “semi-cured product”. Furthermore, as a resultof the curing reaction progressing, the curing reaction of thecomposition stops, curing reactivity is lost, and a state is reached inwhich the curing reaction does not progress any further, which isreferred to as the “main cured state”.

Component (c2) is a hydrosilylation reaction catalyst that does notexhibit activity without irradiating with a high energy beam, butexhibits activity by irradiating a high energy beam. Component (c2) is aso-called high energy beam activated catalyst or photoactivatedcatalyst, which is known in the present technical field.

Examples of high energy beams include ultraviolet rays, gamma rays,X-rays, alpha rays, electron beams, and the like. In particular,examples include ultraviolet rays, X-rays, and electron beams irradiatedfrom a commercially available electron beam irradiating device. Ofthese, ultraviolet rays are preferable from the perspective ofefficiency of catalyst activation, and ultraviolet rays within awavelength range of 280 to 380 nm are preferable from the perspective ofindustrial use. Furthermore, the amount of irradiation varies dependingon the type of high energy beam activated catalyst, but in the case ofultraviolet rays, the integrated amount of irradiation at a wavelengthof 365 nm is preferably within a range of 100 mJ/cm² to 10 J/cm².

Specific examples of component (c2) include (methylcyclopentadienyl)trimethyl platinum (IV), (cyclopentadienyl) trimethyl platinum (IV),(1,2,3,4,5-pentamethyl cyclopentadienyl) trimethyl platinum (IV),(cyclopentadienyl) dimethylethyl platinum (IV), (cyclopentadienyl)dimethylacetyl platinum (IV), (trimethylsilyl cyclopentadienyl)trimethyl platinum (IV), (methoxycarbonyl cyclopentadienyl) trimethylplatinum (IV), (dimethylsilyl cyclopentadienyl)trimethylcyclopentadienyl platinum (IV), trimethyl (acetylacetonato)platinum (IV), trimethyl (3,5-heptanedionate) platinum (IV), trimethyl(methylacetoacetate) platinum (IV), bis(2,4-pentanedionato) platinum(II), bis(2,4-hexanedionato) platinum (II), bis(2,4-heptanedionato)platinum (II), bis(3,5-heptanedionato) platinum (II),bis(1-phenyl-1,3-butanedionato) platinum (II),bis(1,3-diphenyl-1,3-propanedionato) platinum (II), andbis(hexafluoroacetylacetonato) platinum (II). Of these,(methylcyclopentadienyl) trimethyl platinum (IV) andbis(2,4-pentanedionato) platinum (II) are preferred from the perspectiveof versatility and ease of acquisition.

The amount of component (c2) is the amount needed to further cure thecomposition semi-cured by component (c1) and is preferably an amount inwhich metal atoms in the catalyst are within a range of 1 to 50 ppm bymass units, and preferably within a range of 5 to 30 ppm, with regard tothe present composition.

The molar ratio ((c1)/(c2)) of components (c1) and (c2) is usually 0.001to 1000, and preferably 0.01 to 100. This is because the curing reactionby irradiating with a high energy beam can be accelerated when the molarratio is below the above mentioned upper limit, and the curing reactioncan be performed at a low temperature in a short period of time when themolar ratio is above the above mentioned lower limit.

The component (D) is a compound having two or more alkoxysilyl groupsper molecule, and functions as an adhesion promoter to improve theadhesive strength of the present composition, and is a component forexhibiting a unique adhesive behavior in which the adhesive strengthsignificantly increases after a certain period of time. Examples of thealkoxysilyl group include trimethoxysilyl groups, methyldimethoxysilylgroups, triethoxysilyl groups, methyldiethoxysilyl groups, andtriisopropoxysilyl groups.

Component (D) preferably contains (d1) an organic compound having two orthree alkoxysilyl groups at an end of a molecular chain. Furthermore,the organic compound herein include organic silicon compounds inaddition to alkane compounds and the like. Specific examples ofcomponent (d1) include 1,2-bis(trimethoxysilyl) ethane,1,2-bis(triethoxysilyl) ethane, 1,2-bis(methyldimethoxysilyl) ethane,1,2-bis(methyldiethoxysilyl) ethane, 1,3-bis(trimethoxysilyl) propane,1,4-bis(trimethoxysilyl) butane, 1,4-bis(triethoxysilyl) butane,1-methyldimethoxysilyl-4-trimethoxysilylbutane,1-methyldiethoxysilyl-4-triethoxysilylbutane,1,4-bis(methyldimethoxysilyl) butane, 1,4-bis(methyldiethoxysilyl)butane, 1,5-bis(trimethoxysilyl) pentane, 1,5-bis(triethoxysilyl)pentane, 1,4-bis(trimethoxysilyl) pentane, 1,4-bis(triethoxysilyl)pentane, 1-methyldimethoxysilyl-5-trimethoxysilylpentane,1-methyldiethoxysilyl-5-triethoxysilylpentane,1,5-bis(methyldimethoxysilyl) pentane, 1,5-bis(methyldiethoxysilyl)pentane, 1,6-bis(trimethoxysilyl) hexane, 1,6-bis(triethoxysilyl)hexane, 1,4-bis(trimethoxysilyl) hexane, 1,5-bis(trimethoxysilyl)hexane, 2,5-bis(trimethoxysilyl) hexane,1-methyldimethoxysilyl-6-trimethoxysilylhexane,1-phenyldiethoxysilyl-6-triethoxysilylhexane,1,6-bis(methyldimethoxysilyl) hexane, 1,7-bis(trimethoxysilyl) heptane,2,5-bis(trimethoxysilyl) heptane, 2,6-bis(trimethoxysilyl) heptane,1,8-bis(trimethoxysilyl) octane, 1,8-bis(methyldimethoxysilyl) octane,2,5-bis(trimethoxysilyl) octane, 2,7-bis(trimethoxysilyl) octane,1,9-bis(trimethoxysilyl) nonane, 2,7-bis(trimethoxysilyl) nonane,1,10-bis(trimethoxysilyl) decane, 3,8-bis(trimethoxysilyl) decane, andother alkane compounds having two alkoxysilyl groups,1,3-bis{2-(trimethoxysilyl) ethyl}-1,1,3,3-tetramethyldisiloxane,1,3-bis{2-(methyldimethoxysilyl) ethyl}-1,1,3,3-tetramethyldisiloxane,1,3-bis{2-(triethoxysilyl) ethyl}-1,1,3,3-tetramethyldisiloxane,1,3-bis{2-(methyldiethoxysilyl) ethyl}-1,1,3,3-tetramethyldisiloxane,1,3-bis{6-(trimethoxysilyl) hexyl}-1,1,3,3-tetramethyldisiloxane,1,3-bis{6-(triethoxysilyl) hexyl}-1,1,3,3-tetramethyldisiloxane, andother disiloxane compounds having two alkoxysilyl groups. Furthermore,examples of organic compounds having three alkoxysilyl groups include1,3,5-tris{2-(trimethoxysilyl) ethyl}-1,1,3,5,5-pentamethyl trisiloxane,1,3,5-tris{2-(methyldimethoxysilyl)ethyl}-1,1,3,5,5-tetramethyldisiloxane, 1,3,5-tris{2-(triethoxysilyl)ethyl}-1,1,3,5,5-tetramethyldisiloxane,1,3,5-tris{2-(methyldiethoxysilyl) ethyl}-1,1,3,5,5-tetramethyldisiloxane, 1,3,5-tris{6-(trimethoxysilyl) hexyl}-1,1,3,5,5-tetramethyldisiloxane, and other trisiloxane compounds having three alkoxysilylgroups. An example of the structure is:

(MeO)₃SiCH₂CH₂(Me)₂Si—O—SiMe(CH₂CH₂Si(OMe)₃)—O—Si(Me)₂CH₂CH₂Si(OMe)₃

(where Me represents a methyl group).

While not limited thereto, the amount of component (D) is preferablywithin a range of 0.01 to 5 mass parts, or within a range of 0.01 to 3mass parts, relative to 100 mass parts of the total of components (A) to(C) because curing properties and discoloration of the cured product arenot promoted.

In the curable silicone composition of the present invention, the amountof polyether compounds is 0.1 mass % or less relative to the totalamount of the curable silicone composition. This is because a curedproduct having high transparency can be obtained when the amount of thepolyether compound is 0.1 mass % or less.

Examples of the polyether compound include polyether compounds with ahydroxyl group, an alkoxy group, or an acyloxy group at an end, andexamples of a polyether structure of a main chain includepolyoxyethylenes, polyoxypropylenes, and polyoxybutylenes.

More specifically, the polyether may be a polyoxyalkylene compound asexpressed by general formula:

XO—(C₂H₄O)_(p)(C_(n)H_(2n)O)_(q)(YO)_(r)—X

In the aforementioned formula, X represents the same or differenthydrogen atom, alkyl group having 1 to 12 carbon atoms, alkenyl grouphaving 2 to 12 carbon atoms, aryl group having 6 to 20 carbon atoms,acyl group having 1 to 12 carbon atoms, acryl group, or methacryl group.Exemplary alkyl groups of X include methyl groups, ethyl groups, propylgroups, butyl groups, pentyl groups, hexyl groups, heptyl groups, octylgroups, nonyl groups, decyl groups, undecyl groups, and dodecyl groups.Exemplary alkenyl groups of X include vinyl groups, allyl groups,2-methyl-2-propene-1-yl groups (so-called methallyl groups),3-buten-1-yl groups, 3-methyl-3-butene-1-yl groups, 4-butene-1-ylgroups, 5-pentene-1-yl groups, 4-vinylphenyl groups, and4-(1-methylvinyl)phenyl groups. Exemplary aryl groups of X includephenyl groups, o-methylphenyl groups, p-methylphenyl groups,o-phenylphenyl groups (so-called o-biphenyl groups), p-phenylphenylgroups (so-called p-biphenyl groups), and p-nonylphenyl groups.

Furthermore, in the aforementioned formula, Y represents a divalenthydrocarbon group having 2 to 20 carbon atoms, and specific examplesthereof include ethylene groups, propylene groups, butylene groups,pentylene groups, neopentylene groups, hexylene groups, 1,4-phenylenegroups, 2-methyl-1,4-phenylene groups, 2-phenyl-1,4-phenylene groups,and 4,4′-(propane-2,2-diyl)diphenyl groups.

Furthermore, in the formula, n represents an integer of 3 to 6.

Furthermore, in the above formula, p is an integer satisfying 2≤p≤100,preferably an integer satisfying 2≤p≤75 or 2≤p≤50. In contrast, q is aninteger satisfying 0≤q≤50, preferably an integer satisfying 0≤q≤30 or2≤q≤30.

Furthermore, in the formula, r represents an integer of 0 or 1.

The polyoxyalkylene compound is a polyoxyalkylene compound containingone type or a mixture of two or more types expressed by theaforementioned general formula. In the general formula of thepolyoxyalkylene compound, units expressed by the formula: C₂H₄O, unitsexpressed by the formula: C_(n)H_(2n)O, and units represented by theformula: YO may each be randomly connected or may each be connected in ablock shape.

Examples of the polyoxyalkylene compound include the followingcompounds. Note that in the formula, Me represents a methyl group, X¹,X², X³, X⁴, and X⁵ represent a methyl group, allyl group, methallylgroup, acryl group, and hydrogen atom, respectively, p represents aninteger between 2 and 100, and q represents an integer between 1 and 50.Note that any unit may be randomly connected or may be connected by ablock.

X²O(C₂H₄O)_(p)[CH₂CH(Me)O]_(q)X²

X³O(C₂H₄O)_(p)[CH₂CH(Me)O]_(q)X³

X⁴O(C₂H₄O)_(p)[CH₂CH(Me)O]_(q)X⁴

X²O(C₂H₄O)_(p)[CH₂CH(Me)O]_(q)X¹

X³O(C₂H₄O)_(p)[CH₂CH(Me)O]_(q)X¹

X⁴O(C₂H₄O)_(p)[CH₂CH(Me)O]_(q)X¹

X⁵O(C₂H₄O)_(p)[CH₂CH(Me)O]_(q)X¹

X⁵O(C₂H₄O)_(p)[CH₂CH(Me)O]_(q)X²

X⁵O(C₂H₄O)_(p)[CH₂CH(Me)O]_(q)X⁴

X²O(C₂H₄O)_(p)x²

X³O(C₂H₄O)_(p)x³

X⁴O(C₂H₄O)_(p)x⁴

X²O(C₂H₄O)_(p)x¹

X³O(C₂H₄O)_(p)x¹

X⁴O(C₂H₄O)_(p)x¹

X⁵O(C₂H₄O)_(p)x¹

X⁵O(C₂H₄O)_(p)x²

X⁵O(C₂H₄O)_(p)x⁴

X²O(C₂H₄O)_(p)-p-C₆H₄—C₉H₁₉

X³O(C₂H₄O)_(p)-p-C₆H₄—C₉H₁₉

X⁴O(C₂H₄O)_(p)-p-C₆H₄—C₉H₁₉

X²O(C₂H₄O)_(p)—C₆H₅

X³O(C₂H₄O)_(p)—C₆H₅

X⁴O(C₂H₄O)_(p)—C₆H₅

X²O(C₂H₄O)_(p)-p—C₆H₄—CMe₂-p—C₆H₄—O(C₂H₄O)_(p)X²

X³O(C₂H₄O)_(p)-p—C₆H₄—CMe₂-p—C₆H₄—O(C₂H₄O)_(p)X³

X⁴O(C₂H₄O)_(p)-p—C₆H₄—CMe₂-p—C₆H₄—O(C₂H₄O)_(p)X⁴

In the curable silicone composition of the present invention, the amountof a compound having an epoxy group and alkoxysilyl group is 0.1 mass %or less relative to the total amount of the curable siliconecomposition. This is because a cured product having high transparencycan be obtained when the amount of the compound having an epoxy groupand an alkoxysilyl group is 0.1 mass % or less. This is because thepolyether compounds are inherently water-absorbent, which causesmoisture-derived turbidity in the composition over time, impairingpermanent transparency.

Examples of compounds having an epoxy group and an alkoxysilyl groupinclude 3-glycidoxypropyl trimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyl triethoxysilane,3-glycidoxypropyl methyldiethoxysilane, 2-(3,4-epoxycyclohexyl) ethyltrimethoxysilane, 2-(3,4-epoxycyclohexyl) ethyl methyldimethoxysilane,and 2-(3,4-epoxycyclohexyl) ethyl triethoxysilane.

Moreover, the present composition may contain a hydrosilylation reactionretarder in order to control the time to cure. Examples of thehydrosilylation reaction retarders include: alkyne alcohols such as1-ethynyl cyclohexane-1-ol, 2-methyl-3-butyne-2-ol,3,5-dimethyl-1-hexyne-3-ol, 2-phenyl-3-butyne-2-ol, and the like; enynecompounds such as 3-methyl-3-pentene-1-yne, 3,5-dimethyl-3-hexene-1-yne,and the like; methyl alkenyl siloxane oligomers such as1,3,5,7-tetramethyl-1,3,5,7-tetravinyl cyclotetrasiloxane,1,3,5,7-tetramethyl-1,3,5,7-tetrahexenyl cyclotetrasiloxane, and thelike; alkynoxysilanes such as dimethylbis(3-methyl-1-butyne-3-oxy)silane, methylvinylbis(3-methyl-1-butyne-3-oxy)silane, and the like; alkyneoxysilanecompounds such as methyltris(1-methyl-1-phenyl-propyneoxy)silane,dimethylbis(1-methyl-1-phenyl-propyneoxy)silane,methyltris(1,1-dimethyl-propyneoxy)silane,dimethylbis(1,1-dimethyl-propyneoxy)silane, and the like; andbenzotriazoles.

Because the amount of the hydrosilylation reaction retarder is notlimited and provides sufficient pot life to the present composition, theamount is preferably within a range of 0.0001 to 5 mass parts, within arange of 0.01 to 5 mass parts, or within a range of 0.01 to 3 massparts, relative to 100 mass parts of the total of components (A) to (D).However, when the present composition is left to stand at roomtemperature without heating/irradiating a high energy beam to cure orsemi-cure, the composition does not need to contain a hydrosilylationreaction retardant and is preferred from the perspective of a curingreaction.

Furthermore, so long as an object of the present invention is notimpaired, if necessary, the present composition may containconventionally known additives including: metal oxide fine powder suchas fumed silica, wet silica, and the like; an alkenyl group-containinglow molecular weight siloxane as a reactive diluent such as1,1,3,3-tetramethyl-1,3-divinyldisiloxane,1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane, and the like;and a hindered phenol compound acting as conservation stabilityimprovers such as 2,6-ditert-butyl-4-methylphenol,2,6-ditert-butyl-4-hydroxymethylphenol, 2,6-bis(hydroxymethyl)-p-cresol,and the like, along with a heat-resistant improver such asN-nitrosophenylhydroxylamine aluminum salt and the like.

The present composition may suitably contain a non-reactiveorganopolysiloxane as a plasticizer or viscosity modifier of the curedproduct. Specific examples include straight chain or branchedorganopolysiloxanes and organopolysiloxane resins, which do not containa functional group such as alkenyl groups and the like. In particular,when the component is used, the hardness (degree of needle penetration)and fluidity (viscosity) in the cured or semi-cured state can beadjusted to a desired range.

Although the viscosity of the present invention at 25° C. is notlimited, the viscosity is preferably 100,000 mPa·s or less, within arange of 200 to 100,000 mPa·s, or within a range of 500 to 30,000 mPa·s.This is because, if the viscosity of the present composition is abovethe lower limit of the aforementioned range, the mechanical propertiesof the cured product obtained will be good; however, if, on the otherhand, the viscosity is below the upper limit of the aforementionedrange, the handleability of the composition obtained will be enhancedand air is less likely to be entrained in the cured product. Note thatthese viscosities can be measured by a rotational viscometer.

The present composition can be prepared by uniformly mixing components(A) to (D), and if necessary, any other components. When preparing thepresent composition, mixing can be performed at room temperature usingvarious types of stirrers or kneaders, and if necessary, mixing can beperformed while heating. Furthermore, the order of combining the variouscomponents is not restricted, and mixing can be performed in any order.

Moreover, the present composition can be a one part composition in whichall of the components are blended in the same container, or can be a twopart composition which mixes during use in view of storage stability.

The present composition can be cured in a relatively low temperaturerange (for example, 15 to 80° C. range) including room temperature. Notethat the curing reaction of the present composition can be adjusted to adesired speed based on the concentration of a catalyst metal incomponent (C) and the type or amount of the aforementionedhydrosilylation reaction retarder.

The present composition is useful as various potting agents, sealants,and adhesives/pressure sensitive adhesives, is preferably useful as anoptical pressure sensitive adhesive/adhesive, and is particularly usefulas an optical pressure sensitive adhesive/adhesive for a display. Athigh temperatures or high temperatures and high humidity, the curedproduct thereof has little discoloration and tends not to causeturbidity making it suitable as a material that forms an intermediatelayer between an image displaying part and a protecting part of adisplay.

The present composition can be used not only for liquid crystal displaysbut also for the display field in general, such as organic EL displays,electronic paper displays, plasma displays, and the like. A method ofusing the present composition in the field will be discussed later.

The present composition cures at a relatively low temperature, andtherefore can be suitably applied in coating a substrate with inferiorheat resistance. The type of substrate is generally a transparentsubstrate such as glass, along with synthetic resin films, sheets, andtransparent electrode coatings. Furthermore, examples of a method ofapplying the present composition include dispensing, gravure coating,microgravure coating, slit coating, slot die coating, screen printing,stencil printing, and comma coating.

[Cured Product]

Next, the cured product of the present invention will be described indetail.

The cured product of the present invention (hereinafter, referred to as“the present cured product”) is obtained by curing the curable siliconecomposition described above. While the shape of the cured product is notlimited, examples thereof include sheets, films, tapes, and lumps.Furthermore, integrating with various types of substrates is alsopossible.

The present composition is preferably cured to form an elastomeric(elastic) resin member or a gel-like resin member, and the degree ofneedle penetration at 25° C. as stipulated in JIS K2220 (hereinafter,simply referred to as the “degree of needle penetration”) for thesilicone resin member after curing is preferably within a range of 5 to70 at 25° C. The degree of needle penetration is more preferably withina range of 10 to 60, or 20 to 50. The silicone resin member has moderateflexibility and durability, and has excellent adhesion/adhesionretention and followability between members, and thus can be used as agap sealant composition for a displaying device to achieve a reliablesealing effect.

For example, as a method of forming the present cured product, aftercoating the present composition on a film like substrate, a tape likesubstrate, or a sheet like substrate, a hydrosilylation reaction can beinduced by irradiating with a high energy beam, leaving to stand at roomtemperature, or heating at a low temperature to promote curing.Furthermore, there are cases in which the present composition isarranged between two substrates and then cured with both substratesfirmly bonded. There are also cases in which the present composition issmoothly applied to at least one surface of the substrate, semi-cured,and then non-fluidized. Thereafter, both substrates are adheredtogether, and the present composition is further cured so as to firmlyadhere both substrates. While not limited thereto, the film thickness ofthis cured product is preferably 1 to 100,000 μm, more preferably 50 to30,000 μm.

A laminate body, optical device, and optical display of an embodiment ofthe present invention will be described below. Note that in thefollowing description and drawings, the same reference code is assignedto the same or equivalent elements, and duplicate descriptions areomitted.

A laminate body, optical device, and optical display of an embodiment ofthe present invention will be described below. Note that in thefollowing description and drawings, the same reference code is assignedto the same or equivalent elements, and duplicate descriptions areomitted.

[Laminate Body]

FIG. 1 is a cross sectional view illustrating a laminate body of anembodiment of the present invention. A laminate body 1 of an embodimentof the present invention has a first optical member 20, a second opticalmember 21, and an adhesive layer 15 containing the present cured productdisposed between the two optical members 20 and 21. In the laminate body1, the two optical members 20, 21 are adhered by the adhesive layer 15.The optical members may be transparent or non-transparent, and one orboth optical members may be a single substrate or an optical member thatis itself an independent laminate body, such as a backlight unit. Notethat an optical member configuring the laminate body of the presentinvention is generally provided with a plate shaped portion having aplanar expanse, and the plate shaped portion or the member itself may becurved and may have three-dimensional recesses and protrusions derivedfrom an application of the member.

The first optical member 20 is a first substrate, and the second opticalmember 21 is a second substrate. The two optical members 20 and 21 canoptionally be combined. The two optical members 20 and 21 may beidentical or mutually different.

The optical members 20 and 21 are generally used as components of anoptical display. More specifically, the optical members 20 and 21 canbe, for example, a lens (which may be made of resin or glass), anoptical sheet like member (including a color filter, a polarizer, aretardation plate, a viewing angle expanding film, a brightnessenhancing film, a reflection sheet, and a transparent conductive film),an optical protecting material which may be transparent (a transparentprotecting material (transparent protecting film) and the like, whichmay be made of glass, resin, or a resin coating layer), a front displaypanel, a touch panel (made of glass or resin), or an ITO or ATO film orother transparent electrode layer. Needless to say, the displaying panelor touch panel surface may be further provided with an opticalprotecting material. Furthermore, the optical member may be a backlightunit itself containing a light emitting layer and a displaying surface(displaying panel) described later, or may be a member in which theentire optical member is an independent laminated member, or a module ina displaying device such as a touch panel or the like. The adhesivelayer 15 made of the present cured product may be further provide insidethe optical member. In other words, a concept of the optical memberincludes image displaying panels, optical panels, front surface panels,backlight units, touch panel units, and the like, as described later.

Materials of the optical members 20 and 21 are not particularly limitedto those commonly used in the aforementioned applications, and examplesthereof include glass, indium tin oxide (ITO), and other inorganicoptical materials, polycarbonate resins, acrylic resins, epoxy resins,polystyrene resins, polyamide resins, polyimide resins, polyethyleneresins, polypropylene resins, polyvinyl chloride resins, polyvinylidenechloride resins, polyvinyl alcohol (PVA) resins, polyethyleneterephthalate (PET) resins, cyclopolyolefin resins, polyether etherketone resins, polyethylene naphthalate (PEN) resins, liquid crystalpolyarylate resins, polyamide imide resins, polyethersulfone resins,mixtures thereof, and other organic optical materials.

If heat resistance is particularly required, a polyimide resin, apolyetheretherketone resin, a polyethylene naphthalate (PEN) resin, aliquid crystal polyarylate resin, a polyamide imide resin, apolyethersulfone resin, a mixture thereof, or the like may be used.

On the other hand, in applications where visibility is required, such asdisplay devices and the like, a polypropylene resin, a polystyreneresin, a polyvinylidene chloride resin, a PVA resin, a polycarbonateresin, a PET resin, a PEN resin, a mixture thereof, or the like may beused.

The optical members 20 and 21 may be subjected to a surface treatmentgenerally applied thereto as a component of an optical display. Thesurface treatment may be, for example, a primer treatment, a coronatreatment, or the like.

If the two optical members are mutually different, for example, the twooptical members may peel at an adhesive interface due to a difference inthermal expansion coefficients of the two optical members. The presentadhesive layer has flexibility, and therefore, an effect of the thermalexpansion coefficient difference can be reduced, and the two mutuallydifferent optical members 20 and 21 can be favorably bonded. Therefore,the present adhesive phase is suitably used for adhering mutuallydifferent optical members, and particularly for adhering organicmaterials and inorganic materials that have a large difference inthermal expansion coefficient.

Note that although the laminate body 1 illustrated in FIG. 1 has twooptical members, the number of optical members is not particularlylimited so long as the laminate body has a plurality of optical members.

The adhesive layer 15 illustrated in FIG. 1 is formed entirely betweenthe two optical members 20 and 21, but may also be formed in a portionbetween the two optical members 20 and 21. Furthermore, although theadhesive layer 15 illustrated in FIG. 2 is formed between the twooptical members 20 and 21, the adhesive layer 15 may be formed on asurface 20 b opposite from an adhesive surface 20 a of the opticalmember 20, on a surface 21 a opposite from an adhesive surface 21 b ofthe optical member 21, or on both surfaces 20 b and 21 a.

A method of manufacturing a laminate body in an embodiment of thepresent invention will be described below.

FIG. 2 is a flowchart showing a method of manufacturing a laminate bodyin an embodiment of the present invention. The method of manufacturing alaminate body in the embodiment of the present invention includes: anarranging and adhering step S1 of arranging the aforementioned curablesilicone composition, containing at least (c1) the hydrosilylationcatalyst that exhibits activity without irradiating with a high energybeam, on one or two surfaces of at least one member of the two opticalmembers, and then adhering the two optical members together via thecurable silicone composition; and a curing step S2 of promoting ahydrosilylation reaction of the composition by allowing to stand orheating to cure the composition.

In the arranging step S1, the present composition is disposed on amember using the coating method described above, for example. In thearranging step S1, the present composition may be disposed on onesurface of one of the optical members. Furthermore, the cured productdisposed on two surfaces of the optical member and is not used foradhering with another optical member may be used as an adhesive surfacefor bonding to a release layer or another member.

Furthermore, in another embodiment, in the arranging step S1, thepresent composition may be disposed on one surface of each of the twooptical members.

In the embodiment described above, “one surface” is a surface facing theother optical member.

Furthermore, in another embodiment, in the arranging step S1, thepresent composition may also be disposed on another surface positionedopposite from the one surface described above.

In the curing step S2, the present composition is cured in a lowtemperature region (15 to 80° C.) including room temperature (25° C.).Note that in the embodiments of the present invention, “low temperature”refers to a temperature range of, for example, 15° C. to 80° C. When thereaction of the present composition (including a semi-cured product)proceeds in the temperature range of 15 to 80° C., the presentcomposition may suitably be left at or near room temperature range (atemperature range that can be reached without heating or cooling,particularly including a temperature range of 20 to 25° C.), may becooled to 15° C. to room temperature, or may be heated to roomtemperature to 80° C.

A method of manufacturing a laminate body in another embodiment of thepresent invention includes: an arranging step S1 of arranging theaforementioned curable silicone composition containing at least (c2) thehydrosilylation catalyst that exhibits activity by irradiating with ahigh energy beam on one or two surfaces of at least one member of thetwo optical members, and then adhering the two optical members togethervia the curable silicone composition; and a curing step S2 of promotinga hydrosilylation reaction of the composition by allowing to stand orheating after irradiating with the high energy beam to cure thecomposition.

In the curing step S2, a high energy beam is irradiated. Thereby, thepresent cured product in which the present composition is cured isobtained. The high energy beam is as described above, and is preferablyultraviolet rays.

FIG. 3 is a flowchart showing a method of manufacturing a laminate bodyin yet another embodiment of the present invention. A method ofmanufacturing a laminate body in yet another embodiment of the presentinvention includes the following steps:

Step i): A step S1 of arranging the aforementioned curable siliconecomposition containing at least (c2) the hydrosilylation catalyst thatexhibits activity by irradiating with a high energy beam, on one or twosurfaces of at least one member of two optical members;Step ii): A step S21 of performing high energy beam irradiation on thecomposition disposed in step i) to bring the composition into anon-fluid, semi-cured state;Step iii): A step S3 of adhering together the two optical members viathe curable silicone composition in a semi-cured state after step ii);andStep iv): A step S22 of promoting a hydrosilylation reaction of thecomposition within a temperature range of 15 to 80° C. for the twooptical members adhered together in step iii) to main cure thecomposition.

In the semi-curing step S21, the present composition is irradiated withthe high energy beam. Thereby, a semi-cured product in which ahydrosilylation reaction is promoted is obtained.

In the curing step S22, unlike the curing step S2 in FIG. 2, thesemi-cured product is allowed to undergo a curing reaction within thetemperature range of 15 to 80° C. to perform main curing. Thereby, thepresent cured in which the semi-cured product is further cured isobtained.

A method of manufacturing a laminate body in another embodiment of thepresent invention includes the following steps:

Step i): A step S1 of arranging the aforementioned curable siliconecomposition containing both (c1) the hydrosilylation catalyst thatexhibits activity without irradiating with a high energy beam and (c2)the hydrosilylation catalyst that exhibits activity by irradiating witha high energy beam, on one or two surfaces of at least one member of twooptical members, where a transparent optical member is used as the atleast one member;Step ii): A step S21 of promoting a hydrosilylation reaction of thecomposition by allowing the composition to stand at room temperature orheating the composition disposed in step i) to bring the compositioninto a non-fluid, semi-cured state;Step iii): A step S3 of adhering together the two optical members viathe curable silicone composition in a semi-cured state after step ii);andStep iv): A step S22 of performing high energy beam irradiation on thecurable silicone composition via the transparent optical member, andthen promoting a hydrosilylation reaction of the composition in asemi-cured state within a temperature range of 15 to 80° C., for the twooptical members adhered together in step iii), to main cure thecomposition.

In the semi-curing step S21, the reaction of the present composition isallowed to proceed within the temperature range of 15 to 80° C. Thereby,a semi-cured product in which a hydrosilylation reaction is promoted isobtained.

In the curing step S22, unlike the curing process S2 in FIG. 2, thesemi-cured product is irradiated with the high energy beam. Thereby, thepresent cured in which the semi-cured product is further cured isobtained.

A method of manufacturing a laminate body in another embodiment of thepresent invention includes the following steps:

Step i): A step S1 of arranging the aforementioned curable siliconecomposition containing at least (c1) the hydrosilylation catalyst thatexhibits activity without irradiating with a high energy beam, on one ortwo surfaces of at least one member of two optical members;Step ii): A step S21 of promoting a hydrosilylation reaction of thecomposition disposed in step i) within a temperature range of 15 to 80°C. to bring the composition into a non-fluid, semi-cured state;Step iii): A step S3 of adhering together the two optical members viathe curable silicone composition in a semi-cured state after step ii);andStep iv): A step S22 of further promoting a hydrosilylation reaction ofthe composition in a semi-cured state within a temperature range of 15to 80° C. for the two optical members adhered together in step iii) toprimarily cure the composition.

In the semi-curing step S21, the reaction of the present composition isallowed to proceed within the temperature range of 15 to 80° C. Thereby,a semi-cured product in which a hydrosilylation reaction is promoted isobtained.

In the curing step S22, unlike the curing step S2 in FIG. 2, thesemi-cured product is further allowed to undergo a curing reactionwithin the temperature range of 15 to 80° C. to perform main curing.Thereby, the present cured in which the semi-cured product is furthercured is obtained.

[Optical Device]

An optical device of an embodiment of the present invention (hereinaftermay be referred to as “the present optical device”) is provided with: asubstrate; an optical element disposed on the substrate; and the presentcured product that seals at least a part of the optical element.

The present optical device is, for example, an optical semiconductordevice. Examples of optical semiconductor devices include light emittingdiodes (LEDs), photocouplers, and CCDs. Examples of opticalsemiconductor elements include light emitting diode (LED) elements andsolid state image sensing devices. In particular, the curable siliconecomposition of the present invention can be suitably used even whenso-called Micro LEDs (mini LED) having a structure in which a largenumber of small LED elements are disposed on a substrate arecollectively sealed. At this time, the refractive index of the curedproduct may be adjusted as desired by selecting the type of functionalgroup, such as the amount of the aryl group and the like. Furthermore,the curable silicone composition of the present invention has excellentheat resistance and moisture resistance, and is therefore unlikely tocause a decrease in transparency and is unlikely to cause turbidity.This has the advantage of maintaining good light extraction efficiencyof the optical semiconductor device containing the Micro LED.

An LED will be described below as an example of the present opticaldevice, but the present optical device is not limited thereto. FIG. 4 isa plan view illustrating a Micro LED according to an embodiment of thepresent invention. FIG. 5 is a cross sectional view illustrating theMicro LED according to the embodiment of the present invention.

In an LED 100 illustrated in FIGS. 4 and 5, four rows and four columnsof LED elements (optical elements) 101 are die-bonded onto a lead frame(substrate) 102, respectively, and the LED elements 101 and the leadframe 102 are wire-bonded by bonding wires 104 (not illustrated in FIG.4). A frame material 105 is provided in a periphery of the LED elements101, and the LED elements 101 inside the frame material 105 are sealedby the present cured product 106.

Note that in the Micro LED 100 illustrated in FIGS. 4 and 5, four rowsand four columns of LED elements are sealed in the present curedproduct, but the number and arrangement of the LED elements are notlimited thereto. Furthermore, the curable silicone composition of theembodiment of the present invention is also applicable as an sealingmaterial in a single surface mount type LED.

FIG. 6 is a cross sectional view illustrating a Micro LED 100A accordingto another embodiment of the present invention.

The LED element 101 is disposed on the substrate 102. The LED element101 may optionally be disposed on the substrate 102 via an adhesivelayer. The LED element 101 is sealed by the present cured product 106.

The substrate 102 may optionally be provided with an electrode, andanother optical element or member may be disposed on a surface andinside of the substrate 102.

A surface layer 103 is disposed on an opposite side of the substrate 102with respect to the present cured product 106. The surface layer 103 isa transparent layer, such as glass, PET, or the like, which may be aplurality of layers, and may be internally provided with a transparentadhesive layer. Note that the transparent adhesive layer may be thepresent cured product.

FIG. 7 is a cross sectional view of a Micro LED 100B in which a set ofred (R), green (G), and blue (B) light emitting elements are arranged ona lead frame according to an embodiment of the present invention. Forexample, as illustrated in FIG. 7, three types of light emittingsemiconductor (LED) elements 101R, 101G, and 101B corresponding to thethree primary colors of light, red (R), green (G), and blue (B), aredisposed on the lead frame 102 as a set, and can be sealed by thepresent cured product 106 using or not using a frame material.

A method of manufacturing the present optical device includes either:

an arranging step S1 of heating the present composition to obtain acomposition in which the hydrosilylation reaction has proceeded, andthen arranging the heated composition on an optical element disposed ona substrate; ora heating step of arranging the present composition on an opticalelement disposed on a substrate to obtain a composition in which ahydrosilylation reaction has proceeded; and further includes:a curing step of irradiating a high energy beam to cure the heatedcomposition.

Note that in the arranging step S1 of the method of manufacturing thepresent optical device, instead of heating the present composition, acomposition in which the hydrosilylation reaction has proceeded can beobtained by allowing the present composition to stand in a lowtemperature region (15 the 80° C.) including room temperature, and thenarranging the composition on the optical element arranged on thesubstrate.

As a method of manufacturing the Micro LED illustrated in FIGS. 4 and 5,first, the four LED elements 101 are die-bonded to the lead frame 102,and then the LED elements 101 and the lead frame 102 are wire bondedtogether by a gold bonding wire 104.

Next, the present composition is filled (arranged) inside the framematerial 105 provided in a periphery the four LED elements 101, and thenallowed to stand at 0 to 200° C. to cure. In another embodiment of thepresent invention, after the present composition has been allowed tostand at 0 to 200° C., the composition is arranged inside the framematerial 105 provided in a periphery of the LED elements 101.

Furthermore, the composition is cured after heating by irradiating withthe high energy beam. In this manner, the LED 100 in which the four LEDelements 101 are sealed by the present cured product 106 can beobtained.

[Optical Display]

FIG. 8 is a cross sectional view illustrating an optical display of anembodiment of the present invention. An optical display 200 of anembodiment of the present invention is provided with the aforementionedlaminate body 1 and an image displaying panel 201.

The laminate body 1 and the image displaying panel 201 are adheredbother via an adhesive layer (not illustrated). The adhesive layer maybe configured from the present cured product.

In the optical display 200 illustrated in FIG. 8, the second opticalmember 21 of the laminate body 1 is in contact with the adhesive layer.In the optical display 200 illustrated in FIG. 8, for example, the firstoptical member 20 of the laminate body 1 can be a polarizing film andthe second optical member 21 can be a phase difference film.Furthermore, in another embodiment, for example, the first opticalmember 20 of the laminate body 1 can be a polarizing film and the secondoptical member 21 can be a surface protective film.

The image displaying panel 201 is not particularly limited so long asimage information is displayed. For example, in the case of a liquidcrystal display (LCD), the image displaying panel 201 is configured froma polarizing film, a phase difference film, a color filter, an enlargedviewing angle film, a brightness enhancing film, a reflection sheet, orother optical film, a liquid crystal material, a transparent substrate,and a backlight system (Normally, an adhering surface of a pressuresensitive adhesive component or a pressure sensitive adhesive layer tothe image displaying panel is an optical film). There are STN, VA, IPS,and other systems depending on a control system of a liquid crystalmaterial, but any method may be used. Furthermore, the image displayingpanel 201 may be an in-cell type in which a touch panel function isinternally provided in a TFT-LCD, or an on-cell type in which a touchpanel function is internally provided between a polarizing plate and aglass substrate provided with a color filter. On the other hand, in thecase of an organic LED display, the image displaying panel 201 isconfigured from an organic LED element substrate or a laminate body ofan organic LED element substrate and another optical film and the like.

The optical display 200 can be a cathode ray tube (CRT) display or aflat panel display (FPD). Examples of FPDs include LCDs, electrochromicdisplays (ECD), and other light receiving display devices, organic ELdisplays, inorganic EL displays, and other field emitting displays(ELD), plasma displays (PDP), surface conducting electron emitterdisplays (SED), and other field emission displays (FED), and LEDdisplays and other light emitting display devices.

FIG. 9 is a cross sectional view illustrating an optical display ofanother embodiment of the present invention. An optical display 300A ofanother embodiment of the present invention is provided with: an imagedisplaying panel 301; the optical member 20; and the adhesive layer 15made of the present cured product disposed between the image displayingpanel 301 and the optical member 20.

The image displaying panel 301 is a first member, and the optical member20 is a second member.

The image displaying panel 301 can be the image displaying panelexemplified by the image displaying panel 201.

The optical display 300A can be obtained, for example, by arranging theoptical member 20 on one surface 301 a of the image displaying panel 301via a composition layer made from the present composition, semi-curingthe composition layer within a temperature range of 15 to 80° C., andthen further curing the composition layer by irradiating the compositionlayer with a high energy beam. Note that the process of semi-curingwithin the temperature range of 15 to 80° C. may be replaced byirradiation with a high energy beam, and the process of curing byirradiation with a high energy beam can be replaced with a process ofcuring within a temperature range of 15 to 80° C.

In another embodiment of the present invention, for example, acomposition layer made from the present composition formed on onesurface 20 a of the optical member 20 is semi-cured within a temperaturerange of 15 to 80° C., the optical member 20 is arranged on the onesurface 301 a of the image displaying panel 301 via the semi-curedcomposition layer, and then the composition layer is further cured byirradiating the composition layer with a high energy beam. Note that theprocess of semi-curing within the temperature range of 15 to 80° C. maybe replaced by irradiation with a high energy beam, and the process ofcuring by irradiation with a high energy beam can be replaced with aprocess of curing within a temperature range of 15 to 80° C.

FIG. 10 is a cross sectional view illustrating an optical display ofanother embodiment of the present invention. An optical display 300 B ofanother embodiment of the present invention is provided with: the imagedisplaying panel 301; a touch panel 302; and the adhesive layer 15 madefrom the present cured product disposed between the image displayingpanel 301 and the touch panel 302.

The touch panel 302 is not particularly limited and may be any of aresistive film system, a capacitive system, an electromagnetic inductionsystem, a combination thereof, and the like. The touch panel 302 ispreferably provided with at least one of transparent electrode layersuch as a cover film, ITO, ATO film, or the like, or a glass substrate.The touch panel may further contain a decorative film or the like.

In the optical display of an embodiment of the present invention, thevisibility of the optical display can be enhanced by adhering orpressure sensitive adhering between a displaying part such as a liquidcrystal/organic EL or the like and a display forming member such as atouch panel, cover lens, or the like or between display forming membersvia the cured product of the curable silicone composition of the presentinvention.

The image displaying surface of the display may be flat, curved, orflexed.

The optical display of an embodiment of the present invention may beused, for example, in mobile phones, fixed-line phones, and othercommunicating devices; tablets, desktops, notebook terminals, and othercomputer devices; TVs; printers; ATMs (automated teller machines);in-vehicle monitors and navigation systems; digital cameras; videocameras; medical equipment; PDAs (mobile terminals); clocks; electronicpapers; CDs, DVDs, and Blue-ray disc players; SSMs, HDs, and othersolid-state electronic storage media players; electronic book devices;portable game devices, fixed game devices, and other gaming devices; POSsystems; fish finders; automatic ticket vending machine; instrumentpanels; and other applications.

Furthermore, the optical display of an embodiment of the presentinvention may, in addition to the aforementioned configurations, beprovided with: a first member, which is any one of a first opticalmember, an image displaying panel, or a first touch panel; a secondmember, which is any one of a second optical member, a transparentprotective member, or a second touch panel; and an adhesive layer madefrom the present cured product disposed between the first member and thesecond member.

Specifically, as necessary, a resin member, a so-called dam material,can be formed into a frame shape in a displaying module, an opticalelastic resin (hereinafter referred to as “optically clear resin (OCR)”)can be coated therein, and a front surface panel can be adhered fromabove. Furthermore, depending on the site to be injected or arranged, adispenser such as a syringe, a cartridge, or the like may be used toinject and fill the curable silicone composition according to thepresent invention, and the OCR may be arranged. Furthermore, dependingon the structure of the displaying module and the viscosity andapplication form of the OCR, a dam material may be provided only in apart of the displaying module, or may be adhered by the OCR as astructure in which the dam material is not provided at all, that is, aso-called damless structure.

Note that for an OCR coating step (in the case of optical bonding), anadhering step, or the like, which are necessary for manufacturing adisplaying device having a front surface panel, a conventionally knownadhering method under an atmospheric pressure environment may be adoptedwithout limiting to the aforementioned reduced pressure environment.Examples include: a method coating OCR to a front surface panel sideunder an atmospheric pressure environment, reversing and adhering thefront surface panel to a displaying module (reversed adhering method); amethod of arranging a front surface panel and a displaying module inparallel with a predetermined gap therebetween and then filling OCRbetween the gaps (gap dispensing method); and the like.

Typical methods for producing optical displays of the present inventionmay include, for example, a dam fill method. Specifically, a dammaterial is dispensed to a width of than 1 mm or less in accordance withthe shape of the display on an organic optical resin, such as glass orpolycarbonate used as a cover lens, and cured by various methods.Subsequently, a method for producing an optical display is exemplified,wherein the curable silicone composition of the present invention isdispensed and the image display panel is bonded together, then heated atrelatively low temperatures (for example, 40° C.) to cure the siliconecomposition.

Here, a UV curable, room temperature curable, or heat-curable liquidmaterial having thixotropic properties can be used as the dam material.UV curable silicone materials can be preferably used in view of theirhigh resistance to thermal shock (a so-called thermal cycle).

Furthermore, the optical display of the present invention is rapidlycured at relatively low temperatures, specifically at temperatures of40° C. or lower, and therefore tends not to cause deformation anddeterioration of a thermally unstable material, along with clouding anddiscoloration even if exposed to high temperatures and high humidity,enabling improvements in the reliability of the optical display.

An optical display of an embodiment of the present invention may furtherbe a displaying device provided with:

a shield substrate provided on a surface of the front surface panelfacing the displaying surface and having a surface on which atransparent conductive film is formed; andprovided with:a structure in which the transparent conductive film and the bezel areelectrically connected via a conductive material.

For example, in a displaying device, a shield substrate such as anelectro-magnetic interference (EMI) substrate and the like with aconductive layer on one surface can be further inserted between thedisplaying module and the front surface panel. The shield substrate hasan electromagnetic wave shielding function, and therefore prevents thefront surface panel from malfunctioning due to electromagnetic wavesradiating from the displaying module. Furthermore, a conductive layermade from a transparent conductive film such as ITO or the like isformed uniformly or in a mesh-like manner on one surface of the shieldsubstrate. Furthermore, in order to set the potential of the conductivelayer to a GND of the displaying module, an adhesive member or the likedisposed in an outer periphery of the bezel can be formed by aconductive adhesive member such as Ag paste or the like, for example.Note that the bezel of the displaying module is made from a metal and isconnected to the GND in the displaying module. Herein, by using aconductive material as the adhesive member, the metal bezel and theconductive layer of the shield substrate can be securely connected tothe GND, thereby providing a displaying device with strongelectromagnetic wave resistance.

FIG. 11 is an exploded perspective view illustrating an optical displayof another embodiment of the present invention. FIG. 12 is a partialcross sectional view illustrating an optical display of anotherembodiment of the present invention, and is a cross sectional view ofthe optical display illustrated in FIG. 11.

As illustrated in FIGS. 11 and 12, a displaying device 400 (opticaldisplay) according to the present invention is provided with: adisplaying panel 110 having a displaying surface 111; a bezel 120 havinga frame part 121 and an opening end 122 inside the frame part 121 andcovering a circumferential edge on the displaying surface 111 side ofthe displaying panel 110 by the frame part 121; a front surface panel130 provided sandwiching the bezel 120 against the displaying surface111 side of the display panel 110, a resin member 140 that is directlybelow the opening end 122 of the bezel 120 and fills a gap 172 generatedat an overlapping portion between the bezel 120 and the displayingsurface 111 in a direction orthogonal to the displaying surface 111without any gaps, and an OCR 150 filled between the displaying surface111 and the front surface panel 130. Herein, the displaying surface 111refers to an entire surface of the displaying panel 110 on the frontsurface panel 130 side.

The displaying panel 110 is mounted on a backlight unit 171, and thebezel 120 and the backlight unit 171 are secured by a mating structure(not illustrated) to configure a displaying module 170. Entire surfacesof the displaying module 170 and the front surface panel 130, such asthe touch panel or the like, are all adhered together via the OCR 150.

In the embodiment of the present invention, the curable siliconecomposition of the present invention can be applied to an inner layer ofthe front surface panel 130, OCR 150, resin member 140 under the bezel,and the like. Note that although not limited to these applications, thecurable silicone compositions of the present invention can be used forbonding and for filling in or between the members illustrated in FIGS.11 and 12.

FIGS. 13 to 15 are partial cross sectional views illustrating opticaldisplays of other embodiments of the present invention. Note that FIGS.13 to 15 are diagrams corresponding to FIG. 12.

The partial cross sectional view illustrated in FIG. 13 illustrates astructure in which a dam (resin member) 140 is further provided on thebezel 120 illustrated in FIG. 12, and a space 173 between the bezel 120and the front surface panel 130 is filled with the OCR 150 made from thepresent cured product, a so-called two-level dam structure.

Furthermore, the bezel 120 illustrated in FIGS. 11 to 13 is notessential. The partial cross sectional view illustrated in FIG. 14illustrates a structure in which the dam 140 is provided on a backlightunit 170A and a space 173 between the backlight unit 170A and the frontsurface panel 130 is filled with the OCR 150 made from the present curedproduct, without arranging the bezel 120.

Furthermore, the partial cross sectional view illustrated in FIG. 14illustrates a structure in which the space 173 between the bezel 120 andthe front surface panel 130 is filled with the OCR 150 made from thepresent cured product without the bezel 120 and the dam 140, theso-called damless structure. The structure illustrated in FIG. 14 can beachieved by making the composition non-fluid during semi-curing.

SUMMARY

The displaying device is preferably a displaying device having astructure in which the space between the displaying surface and thefront surface panel is filled by a substantially transparent opticalelastic resin member or an optical gel-like resin member. By using theoptical elastic resin member or optical gel-like resin member as an OCRfor optical bonding, the display performance and durability of thedisplaying device can be improved, and thus a highly reliable displayingdevice can be provided.

The OCR is preferably obtained by curing the curable resin composition,and examples include silicone resin cured products (member) having thephysical properties of the aforementioned degree of needle penetration,shear adhesive strength, and the ratio of displacement to samplethickness at maximum adhesive strength, and formed by photocuringincluding irradiating with UV light.

Furthermore, the present composition has excellent durability at lowtemperatures and can obtain a cured product with excellent transparency.Therefore, for example, it is possible to provide a highly reliablelaminate body, an optical device, and an optical display in an operatingenvironment such as in winter, cold regions, and the like. Inparticular, the cured product obtained by curing the present compositioncontains a certain amount of aryl groups bonded to atoms in silicon inthe composition. Furthermore, the aryl groups are dispersed in a stateof high compatibility with another curable component, and aheterogeneous molecular sequence derived from the aryl group is randomlyintroduced in the highly transparent cured product. As a result, ascompared with a case where the cured product essentially does notcontain an aryl group or a main molecular structure of the cured productis a silicon atom aryl group as a result of containing a large amount ofaryl group, change in the elastic modulus of the cured product issuppressed even at a low temperature, and cold resistance is improved.At the same time, the reliability and low temperature durability areimproved in electronic components such as optical devices, opticaldisplays, and the like provided with the curable organopolysiloxanecomposition or the cured product thereof.

Furthermore, the present invention does not preclude the adoption of astructure in which an additional dam material is provided on an outerside of the silicone resin member filling the gap between the bezel andthe displaying panel as a dam material to partially or completely blockthe gap, provided that a technical effect of the present invention isnot impaired. For example, if a special shape is adopted for a part ofthe bezel for design reasons and the gap cannot be completely closedusing the method described above, the curable resin composition servingas a dam material may be injected pinpointly in the point.

Furthermore, although the shape of the front surface panel has beendescribed as a rectangular shape, the shape does not need to be arectangle, but may be an arbitrary polygon, a flat plate having a curvedportion, or a combination thereof, and may even be a three-dimensionalshape.

INDUSTRIAL APPLICABILITY

The curable silicone composition of the present invention has excellenttransparency and adhesive properties, and also has excellent durability(cold resistance) at low temperatures. Moreover, cracking of the curedproduct or a decrease in the elastic modulus do no occur even when usedat low temperatures. Therefore, the composition is suitable for anadhering step and the like in the manufacture of optical displays andtouch panels. Furthermore, the product thereof has high transparency andexcellent adhesive strength, and therefore can be suitably used foroptical displays and touch panels. Furthermore, as described above, theimage displaying surface of the display may be flat, curved, or flexed.

The curable silicone composition of the present invention has excellentcurability and high cold resistance, and maintains transparency evenwhen exposed to high temperature and high humidity. Moreover, thecomposition forms a cured product that is less likely to become turbidor discolored, and therefore is useful as an adhesive or a pressuresensitive adhesive for use in displaying devices such as opticaldisplays and the like (including touch panels) and optical semiconductordevices (including Micro LEDs). Furthermore, the curable siliconecomposition of the present invention can be used without limitation foradhering or filling a transparent member, not limited to opticaldisplays and the like. For example, the curable silicone composition canbe used in solar cells, multi-layer glass (smart glass), opticalwaveguide, projector lens (multi-layer lens, polarizing/optical filmadhering), and the like.

In addition thereto, the curable silicone composition of the presentinvention has a general advantage of silicone OCR, where curingshrinkage of the cured product is small, and thus display defects, suchas defects in displays and optical components, unevenness in images, andthe like, can be suppressed. In addition thereto, the curable siliconecomposition of the present invention has high followability to anadhesive member due to the flexible nature described above, andexpresses a strong adhesive force after a certain period of time passes.Therefore, the curable silicone composition of the present inventioneffectively suppresses peeling between members, and can be suitably usedfor optical adhesive layers such as in-vehicle displays having flat orcurved displaying surfaces, head-up displays utilizing the projectorlens described above, and the like.

EXAMPLES

The present invention will be described in detail below based onexamples, but the present invention is not limited to the examples.Furthermore, measurements and evaluations in the examples were conductedas follows.

[Degree of Needle Penetration of Cured Product]

A curable silicone composition with a thickness of 10 mm or more wasleft to stand to cure for 48 hours at 25° C. in a petri dish, and thedegree of needle penetration at 25° C. was measured using a needlepenetration measuring device (RPM-201 manufactured by Rigo Co., Ltd.).

[Shear Adhesive Strength of Cured Product]

A curable silicone composition was filled and heated in an oven at 40°C. for one hour such that the dimensions of the cured silicone curedproduct were a length of 25 mm×width of 25 mm×thickness of 200 μmbetween two glass plates (length of 75 mm×width of 25 mm×thickness of 2mm), to cure the composition by heating at room temperature for 48 hoursso as to prepare a test piece containing a cured product sandwichedbetween the two glass plates. The test piece was subjected to a shearadhesion test in accordance with a method specified in JIS K6850, andthe adhesive strength was measured.

[Appearance of Cured Product]

A test piece filled with a curable silicone composition was allowed tostand for 48 hours at 25° C. such that the dimensions of the curedsilicone cured product were a length of 25 mm×width of 25 mm×thicknessof 200 μm between two glass plates (length of 75 mm×width of 25mm×thickness of 2 mm). The cured products were left to stand in afreezer at −55° C. for 500 hours, returned to room temperature forapproximately 2 hours, and then maintained at −55° C. and 85° C. for 30minutes in a cold cycle testing machine, which was repeated 200 times.Thereafter, the appearance thereof was visually observed. As a result,clear cracking was observed.

Examples 1 to 4 and Comparative Examples 1 to 4

The curable silicone compositions were prepared at the compositions(parts by weight) shown in Table 1 using the following components. Ineach structural formula, Me represents a methyl group, Vi represents avinyl group, Ph represents a phenyl group, and Ep represents an epoxygroup.

The following component was used as component (A).

-   -   a1-1: ViMe₂SiO(SiMe₂O)₂₃₂OSiMe₂Vi    -   a1-2: ViMe₂SiO(SiMe₂O)₃₇₂OSiMe₂Vi    -   a1-3: ViMe₂SiO(SiMe₂O)₂₃₃(SiMePhO)₂₄OSiMe₂Vi    -   a1′-1(Comparative component): ViMe₂SiO(SiMe₂O)₃₇₂OSiMe₂Vi    -   a1′-2(Comparative component):        ViMe₂SiO(SiMe₂O)₈₀(SiMePhO)₈₀OSiMe₂Vi    -   a1′-3(Comparative component):        ViMe₂SiO(SiMe₂O)₂₅₆(SiMePhO)₄OSiMe₂Vi    -   a2-1: (ViMe₂SiO_(1/2))_(0.046)(Me3SiO½)0.394(SiO4/2)0.56    -   a2-2: Si(OSiMe₂Vi)₄

The following component was used as component (B).

-   -   b1-1: HMe₂SiO(SiMe₂O)₂₄OSiMe₂H    -   b2-1: (HMe₂SiO_(1/2))_(0.63)(SiO_(4/2))_(0.37)    -   b2-2: (HMe₂SiO_(1/2))_(0.75)(PhSiO_(3/2))_(0.25)

The following component was used as component (C).

-   -   c1-1: Platinum 1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex

The following component was used as component (D).

-   -   d1-1: 1,6-bis(trimethoxysilyl) hexane    -   d1-2: 1,3-bis(trimethoxysilylethyl) tetramethyldisiloxane

The following components were used as other optional components.

Optional component-1: Me₃SiO(SiMe₂O)₄₅₀ (SiMePhO)₄₀OSiMe₃

Table 1-1: Composition of curable silicone composition (Examples 1 to 4)

TABLE 1 Examples 1 2 3 4 A a1-1 86.45 88.07 — — a1-2 — — 88.80 — a1-3 —— — 91.75 a2-1 1.75 — 3.5 1.75 a2-2 — 0.13 — — Comparative component Aa1′-1 — — — — a1′-2 — — — — a1′-3 — — — — B b1-1 6 6 7.5 6.3 b2-1 — — —— b2-2 0.1 0.1 — — C c1-1 0.001 0.001 0.001 0.001 D d1-1 0.2 — 0.2 0.2d1-2 — 0.2 — — Optional Components 5.5 5.5 — — 100.00 100.00 100.00100.00 Number of mols of silicon- 0.87 0.85 0.86 0.84 bonded hydrogenatoms in component B to one mol of alkenyl groups in component A Mol %of aryl groups in 4.3 4.3 3.3 9.8 component a1 or component equivalentto a1 Mol % of aryl groups in all silicon- 4.2 4.3 2.9 8.9 bondedorganic groups of the composition Degree of needle penetration 35 37 4039 Shear adhesive strength after 0.38 0.4 0.37 0.32 curing at 25° C. for48 hours Appearance of laminate sample No change No change No change Nochange after allowing to stand at −55° C. for 500 hours Appearance ofsample after 200 No change No change No change No change cycles of a−55° C./85° C. cold cycle Comparative Examples 1 2 3 4 A a1-1 — — — —a1-2 — — — — a1-3 — — — — a2-1 3.5 3.5 1.75 1.75 a2-2 — — — —Comparative component A a1′-1 — — 90.6 90.6 a1′-2 81.06 — — — a1′-3 —83.56 — — B b1-1 8 7.3 4 6 b2-1 — — 0.08 0.3 b2-2 — — — — C c1-1 0.00050.0005 0.0005 0.0005 D d1-1 0.2 0.2 0.2 0.2 d1-2 — — — — OptionalComponents 5.24 5.24 5.00 — 92.76 94.56 96.63 98.85 Number of mols ofsilicon- 0.86 0.86 0.76 1.37 bonded hydrogen atoms in component B to onemol of alkenyl groups in component A Mol % of aryl groups in 24.5 0.760.0 0.0 component a1 or component equivalent to a1 Mol % of aryl groupsin all silicon- 19.6 0.85 0.19 0.0 bonded organic groups of thecomposition Degree of needle penetration 40 38 49 25 Shear adhesivestrength after 0.2 0.45 0.5 0.52 curing at 25° C. for 48 hoursAppearance of laminate sample Cracking Cracking Cracking Cracking afterallowing to stand at −55° C. occurs occurs occurs occurs for 500 hoursAppearance of sample after 200 Cracking Cracking Cracking Crackingcycles of a −55° C./85° C. cold occurs occurs occurs occurs cycle

Table 1-2: Composition of curable silicone composition (ComparativeExamples 1 to 4)

In Examples 1 to 4, in which the component containing an aryl group ofthe present invention was used and the configuration of the presentinvention was satisfied, cured products (from flexible elastomeric togel-like, and the like) having excellent transparency and adhesivestrength sufficient for practical use could be obtained. Furthermore,the laminate samples containing the cured product maintained favorableappearance without cracking even after being allowed to stand at a lowtemperature of −55° C. or after 200 cycles of the −55° C./85° C. coldcycle. Therefore, the cured product using the curable siliconecomposition of the present invention has excellent cold resistance, doesnot lose elasticity even under low temperature conditions, istransparent, and has excellent adhesive properties.

On the other hand, all of the Comparative Examples that do not satisfythe configuration of the present invention were confirmed to havecracking occur after being allowed to stand at a low temperature of −55°C., and thus cold resistance was not sufficient.

REFERENCE NUMERALS

-   -   1 Laminate body    -   15 Adhesive layer    -   20 First optical member    -   20 a Connection surface    -   20 b Surface    -   21 Second optical member    -   21 a Surface    -   21 b Surface    -   100, 100A LED    -   101, 101B, 101G, 101R LED element (optical element)    -   102 Lead frame (substrate)    -   103 Transparent layer    -   104 Bonding wire    -   105 Frame material    -   106 The cured product    -   110 Displaying panel    -   111 Displaying surface    -   120 Bezel    -   121 Frame part    -   122 Opening end    -   130 front surface panel    -   140 Resin member (dam)    -   150 OCR    -   170, 170A Displaying module    -   171 Backlight unit    -   172 Gap    -   173 Space    -   200 Optical display    -   201 Image displaying panel    -   300A Optical display    -   300B Optical display    -   301 Image displaying panel    -   301 a Surface    -   302 Touch panel    -   400 Display device (optical display)

1. A curable silicone composition, comprising: (A) an organopolysiloxanehaving in a molecule at least 2 alkenyl groups each with 2 to 12 carbonatoms; (B) an organohydrogenpolysiloxane having at least 2silicon-bonded hydrogen atoms per molecule; and (C) a hydrosilylationreaction catalyst; wherein; component (B) is present in an amount suchthat the silicon-bonded hydrogen atoms in component (B) are 0.5 to 2 molper mol of aliphatic unsaturated carbon-carbon bonds in component (A),and 2 to 17.5 mol % of the silicon-bonded organic groups in the curablesilicone composition are aryl groups.
 2. The curable siliconecomposition according to claim 1, wherein 2 to 20 mol % of thesilicon-bonded organic groups in component (A) are aryl groups.
 3. Thecurable silicone composition according to claim 1, wherein component (A)comprises the following components (a1) and (a2): (a1) a straight chainor branched organopolysiloxane having in one molecule at least 2 alkenylgroups with 2 to 12 carbon atoms, where 3 to 25 mol % of silicon-bondedorganic groups are aryl groups; and (a2) an organopolysiloxane having analkenyl group, as expressed by average unit formula: (R¹₃SiO_(1/2))_(a)(R¹ ₂SiO_(2/2))_(b)(R¹SiO_(3/2))_(c)(SiO_(4/2))_(d),where R¹ independently represents a monovalent hydrocarbon group with 1to 12 carbon atoms, at least 1 mol % of R¹ are alkenyl groups with 2 to12 carbon atoms, and a, b, c and d satisfy all of the followingconditions: (a+b+c+d)=1, 0≤a≤0.8, 0≤b≤0.4, 0≤c≤0.8, 0≤d≤0.6, and0.2≤(c+d)≤0.8; and component (B) comprises the following components (b1)and (b2): (b1) a straight chain organohydrogenpolysiloxane having asilicon-bonded hydrogen atom on an end of a molecular chain; and (b2) anorganohydrogenpolysiloxane having 3 or more silicon-bonded hydrogenatoms in one molecule.
 4. The curable silicone composition according toclaim 3, wherein; the amount of component (a2) is within a range of 0.5to 5.0 mass % relative to the sum of components forming a non-volatilesolid fraction by a curing reaction of the curable silicone composition,and the amount of component (b2) is within a range of 0 to 2.0 mass %relative to the sum of components forming a non-volatile solid fractionby a curing reaction of the curable silicone composition.
 5. The curablesilicone composition according to claim 1, further comprising: (D) anorganic compound having two or more alkoxysilyl groups in one molecule.6. The curable silicone composition according to claim 5, wherein; i)the amount of a polyether compound is 0.1 mass % or less relative to thetotal amount of the curable silicone composition, and ii) the amount ofa compound having an epoxy group and alkoxysilyl group is 0.1 mass % orless relative to the total amount of the curable silicone composition.7. The curable silicone composition according to claim 5, wherein theamount of component (D) is within a range of 0.001 to 5 mass % relativeto the total amount of the curable silicone composition.
 8. The curablesilicone composition according to claim 1, wherein component (C) isselected from the group consisting of: (c1) a hydrosilylation reactioncatalyst that exhibits active activity without irradiating with a highenergy beam; (c2) a hydrosilylation reaction catalyst that exhibitsactivity by irradiating with a high energy beam; and (c3) ahydrosilylation reaction catalyst that is a combination of component(c1) and component (c2).
 9. The curable silicone composition accordingto claim 8, wherein the high energy beam is selected from the groupconsisting of ultraviolet rays, gamma rays, X-rays, alpha rays, andelectron beams.
 10. The curable silicone composition according to claim5, wherein component (D) comprises: (d1) a compound having twoalkoxysilyl groups at ends of a molecular chain.
 11. (canceled) 12.(canceled)
 13. A cured product of the curable silicone compositionaccording to claim
 1. 14. The cured product according to claim 13,wherein the degree of needle penetration at 25° C. is within a range of5 to
 70. 15. A laminate body, comprising: an adhesive layer comprisingthe cured product according to claim 13, disposed between a firsttransparent or non-transparent optical member and a second transparentor non-transparent optical member.
 16. An optical device, comprising: asubstrate; an optical element disposed on the substrate; the curedproduct according to claim 13, that seals at least a portion of theoptical element.
 17. An optical display, comprising the laminate bodyaccording to claim
 15. 18. A method of manufacturing a laminate body,comprising: arranging the curable silicone composition according toclaim 8, comprising at least (c1) the hydrosilylation catalyst thatexhibits activity without irradiating with a high energy beam, on one ortwo surfaces of at least one member of the two optical members, and thenadhering the two optical members together via the curable siliconecomposition; and promoting a hydrosilylation reaction of the compositionby allowing to stand or heating to cure the composition.
 19. A method ofmanufacturing a laminate body, comprising: arranging the curablesilicone composition according to claim 8, comprising at least (c2) thehydrosilylation catalyst that exhibits activity by irradiating with ahigh energy beam, on one or two surfaces of at least one member of thetwo optical members, and then adhering the two optical members togethervia the curable silicone composition; and promoting a hydrosilylationreaction of the composition by allowing to stand or heating afterirradiating with the high energy beam to cure the composition.
 20. Amethod of manufacturing a laminate body, comprising the following steps:i) arranging the curable silicone composition according to claim 8,comprising at least (c2) the hydrosilylation catalyst that exhibitsactivity by irradiating with a high energy beam, on one or two surfacesof at least one member of two optical members; ii) performing highenergy beam irradiation on the composition disposed in step i) to bringthe composition into a non-fluid, semi-cured state; iii) adheringtogether the two optical members via the curable silicone composition ina semi-cured state after step ii); and iv) promoting a hydrosilylationreaction of the composition in a semi-cured state within a temperaturerange of 15 to 80° C. for the two optical members adhered together instep iii), to main cure the composition.
 21. A method of manufacturing alaminate body, comprising the following steps: i) arranging the curablesilicone composition according to claim 8, comprising both (c1) thehydrosilylation catalyst that exhibits activity without irradiating witha high energy beam and (c2) the hydrosilylation catalyst that exhibitsactivity by irradiating with a high energy beam, on one or two surfacesof at least one member of two optical members, where a transparentoptical member is used as the at least one member; ii) promoting ahydrosilylation reaction of the composition disposed in step i) within atemperature range of 15 to 80° C. to bring the composition into anon-fluid, semi-cured state; iii) adhering together the two opticalmembers via the curable silicone composition in a semi-cured state afterstep ii); and iv) performing high energy beam irradiation on the curablesilicone composition via the transparent optical member, and thenpromoting a hydrosilylation reaction of the composition in a semi-curedstate within a temperature range of 15 to 80° C., for the two opticalmembers adhered together in step iii), to main cure the composition. 22.A method of manufacturing a laminate body, comprising the followingsteps: i) arranging the curable silicone composition according to claim8, comprising at least (c1) the hydrosilylation catalyst that exhibitsactivity without irradiating with a high energy beam, on one or twosurfaces of at least one member of two optical members; ii) promoting ahydrosilylation reaction of the composition disposed in step i) within atemperature range of 15 to 80° C. to bring the composition into anon-fluid, semi-cured state; iii) adhering together the two opticalmembers via the curable silicone composition in a semi-cured state afterstep ii); and iv) further promoting a hydrosilylation reaction of thecomposition in a semi-cured state within a temperature range of 15 to80° C. for the two optical members adhered together in step iii), tomain cure the composition.
 23. (canceled)
 24. (canceled)